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W2307EP Interconnect Toolbox Element
The W2307EP Interconnect Toolbox Element contains two utilities for the design of high-speed interconnects (transmission lines and via transitions respectively).
Interconnect Toolbox Utility
The Interconnect Toolbox utility enables you to optimize your PC board (PCB) stack up and transmission line geometry using metrics that matter, namely post-equalizer eye diagram parameters. Other tools will show you the impairments of the lines, such as loss, frequency roll off, and impedance variation, but in today’s multi gigabit chip-to-chip links these metrics are inadequate. What really matters is the eye parameters after the line impairments have been mitigated by the signal processing in modern Serializer/Deserializer (SerDes), for example transmitter (Tx) pre-emphasis and reciever (Rx) equalization. In fact the whole point of the signal processing in the I/O of modern chips is to allow you to use lower cost materials and yet still open the eye.
Via Designer Utility
The Via Designer Utility enables the user to quickly design both single-ended and differential via transitions.The via model can be fully parameterized and is analyzed with highly accurate 3D full-wave, Finite Element Method (FEM) simulation technology.